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What are the applications of glue supply systems in the electronics industry
source：m.yunquanquan.cn | Release time：2026年04月14日1、 Semiconductor and Integrated Circuit Field
1. Chip packaging and underfill
For packages such as flip chip and BGA/CSP, the adhesive supply system achieves high-speed and uniform distribution of bottom filling adhesive with millisecond response and micrometer precision. The core process of the packaging process is to eliminate bubbles and impurities in the adhesive through precision temperature control and negative pressure defoaming technology, ensuring rapid flow of the adhesive and complete filling of the gap between the chip and the substrate, enhancing the chip's resistance to thermal shock and mechanical impact.
2. Construction of chip packaging (Glob Top) and dam
Used for overall sealing protection or dam construction on the surface of chips. Through high-precision spraying or dispensing technology, a uniform and non overflow adhesive dam is formed around the chip, and then filled with epoxy or silicone materials to achieve physical isolation between the chip and the external environment, resist moisture, dust, and chemical corrosion, and provide mechanical support and heat dissipation channels for the chip.
3. Potting of micro nano level components
For micro nano components such as sensors, MEMS devices, and micro relays, the glue supply system uses a micro metering pump (with a glue output as low as 0.01ml) and a filtering device to achieve micro sealing, ensuring that there are no bubbles or impurities inside the components, guaranteeing high precision and long-term stability.
2、 PCB and board level assembly field
1. Conformal Coating for PCB Board
For high-density PCB and fine pitch component areas, the adhesive supply system is equipped with non-contact spray valves to achieve uniform, controllable, and no dead corners of the three proof paint coating. Real time monitoring of coating thickness through a closed-loop feedback system ensures thickness fluctuations of ≤ ± 5%, effectively improving the weather resistance and reliability of circuit boards in extreme environments such as humidity, salt spray, and high and low temperatures. It is widely used in automotive electronics and industrial control electronics.
2. Fixed and reinforced board level components
Used for bonding and reinforcement of onboard components such as connectors, sensors, and heat sinks. By using proper adhesive technology, an appropriate amount of structural adhesive is applied to the pins or bottom of the device to enhance the connection strength between the device and PCB, prevent desoldering and loosening caused by vibration, and ensure the mechanical stability of board level components.
3、 Consumer Electronics and 3C Industry
1. Camera module assembly
The adhesive supply system is responsible for precise bonding between the lens and the module, as well as between the module and the motherboard, requiring uniform adhesive volume, no overflow, and correct positioning. The core process of products such as mobile phones, tablets, and drones is to ensure the distribution of glue within a micrometer level error range through high-precision dispensing heads and visual positioning systems, ensuring the optical performance and long-term reliability of the module.
2. Packaging of batteries and energy storage components
Used for cell fixation, battery pack sealing, and thermal conductive coating of soft pack/cylindrical batteries. The adhesive supply system can be equipped with a two-component metering module to correctly mix AB adhesive and control the accuracy of the ratio, achieving structural bonding between the battery shell and the battery cell; At the same time, by coating with thermal conductive adhesive, the heat dissipation efficiency of the battery is improved, ensuring the safety and lifespan of the battery during charge and discharge cycles.
3. Bonding and sealing of structural components
Covering the bonding and sealing of structural components such as phone frames, screen borders, and button components, the adhesive supply system uses high-speed spraying or precision dispensing to achieve rapid coating of hot melt adhesive and structural adhesive, improving production speed and bonding strength, while meeting appearance and functional requirements such as waterproof and dustproof.
4、 Automotive electronics field
1. Packaging and sealing of automotive electronic control unit (ECU)
For onboard electronic systems such as engine control units, body control modules, and radar sensors, the adhesive supply system must meet high temperature resistance, vibration resistance, and high protection requirements. Through high-capacity, uninterrupted glue supply design and dual tank alternating glue replacement technology, efficient sealing and sealing of the ECU housing are achieved, ensuring stable operation of the product under extreme working conditions of -40 ℃~125 ℃.
2. Thermal conductivity and insulation coating
Thermal conductive adhesive used for automotive power devices, IGBT modules, and motor controllers. The adhesive system is correctly coated with high thermal conductivity silicone or thermal interface material (TIM) to reduce the thermal resistance between the device and the heat dissipation structure and improve heat dissipation efficiency; Simultaneously, by coating with insulating adhesive, electrical isolation is achieved to ensure the safety and reliability of onboard electronics.
5、 LED and optoelectronic display field
1. LED packaging and module assembly
For LED chips, beads, and display screen modules, the adhesive system is used for fluorescent powder coating, chip bonding, and module encapsulation. For special materials such as high viscosity silicone and fluorescent adhesive, a dedicated adhesive supply system and surface treatment technology are used to ensure uniform distribution and rapid curing of the adhesive, thereby improving the luminous efficiency and color uniformity of LEDs.
2. Adhesive bonding between backlight and optical components
Used for precision bonding of backlight modules, light guide plates, and optical films, the adhesive supply system ensures the adhesion and transparency of optical components with the characteristics of no overflow and high precision. It is a key process for products such as LCD displays and car displays.
6、 Core advantages of technology and process
High precision adaptation: capable of achieving 0.01ml level micro dispensing and measuring accuracy within ± 1%, covering the full range of adhesive requirements such as low viscosity UV adhesive, high viscosity thermal conductive adhesive, two-component AB adhesive, etc.
Full process temperature control: integrates multi-stage temperature control and PID algorithm, with temperature control accuracy of ± 0.5 ℃~± 3 ℃, suitable for temperature sensitive adhesive and high-temperature curing adhesive, ensuring stable rheological properties of the adhesive.
High compatibility: Adopting corrosion-resistant pipelines such as PTFE/stainless steel and modular design, compatible with various types of adhesives such as solvent based, solvent-free, and filler containing adhesives, supporting multiple packaging forms such as material buckets and plastic bags for feeding.
Automation Integration: Supports integration with robots PLC、 The visual system seamlessly integrates with formula management (255+independent formulas), automatic cleaning, and fault self diagnosis functions, achieving flexible changeover and continuous production.
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